NUF2230XV6
PACKAGE DIMENSIONS
SOT?563, 6 LEAD
CASE 463A?01
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
D
?X?
A
L
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
6
5
4
MILLIMETERS
INCHES
1
2
3
E
?Y?
H E
DIM
A
b
MIN NOM MAX
0.50 0.55 0.60
0.17 0.22 0.27
MIN
0.020
0.007
NOM MAX
0.021 0.023
0.009 0.011
C
D
0.08 0.12 0.18
1.50 1.60 1.70
0.003
0.059
0.005 0.007
0.062 0.066
e
b 65 PL
0.08 (0.003)
M
X Y
C
E
e
L
1.10 1.20 1.30
0.5 BSC
0.10 0.20 0.30
0.043 0.047 0.051
0.02 BSC
0.004 0.008 0.012
H E
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.0
0.0394
1.35
0.0531
0.5
0.5
0.0197 0.0197
mm
SCALE 20:1
inches
1.50 1.60 1.70
0.059 0.062 0.066
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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4
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NUF2230XV6/D
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